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Call for papers: ARM TechCon3

Posted on | June 11, 2009 | No Comments

arm-techcon3I’m really honored to have been picked as this year’s technical chair for ARM’s TechCon3, to be held Oct. 21-23 in Santa Clara. John Reardon, CEO and founder of RTC Group, which manages the event, asked me if I’d be interested. And why not? It’s always been a great program. I’m taking over for Markus Levy, EEMBC’s founder, and I have some massive shoes to fill. But I’ll be working with longtime industry analyst Tom Starnes and former Portable Design Editor John Donovan to pull together a compelling bunch of papers for the program.

The call for papers is live, so if you’re an engineer with a great idea or your represent a company with a great idea, here’s where you start:

The format of the event, which used tobe called ARM DevCon, has changed slightly with the new moniker. This year our focus is on three key areas of technology: Energy Efficiency and Design, Internet Everywhere and MCU and Tools. The last is obvious, given ARM’s role in the electronics world. The first two reflect growing design trends. Energy efficiency really spans the gamut from global concerns about dwindling fossil fuels all the way down to system power consumption–how to optimize battery life and minimize leakage. Internet everywhere reflects the seemingly Herculean task of designing systems that bringing wireless Internet capability into devices the size of your hand.

So, if you’re got an abstract for a paper that will blow the socks off the engineering audience at ARM TechCon3, submit it ASAP. The deadline is July 14.

And if you have any questions, you know where to find me!

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